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LMX321AXK Rev. A
RELIABILITY REPORT FOR LMX321AXK PLASTIC ENCAPSULATED DEVICES
May 26, 2002
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The LMX321 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The LMX321 is a single, low-cost, low-voltage, pin-to-pin compatible upgrade to the LMV321 general-purpose op amp. This device offers Rail-to-Rail(R) outputs and an input common-mode range that extends below ground. This op amp draws only 105A of quiescent current per amplifier, operates from a single +2.3V to +7V supply, and drives 2k resistive loads to within 40mV of either rail. The LMX321 is unity-gain stable with a 1.3MHz gain-bandwidth product capable of driving capacitive loads up to 400pF. The combination of low voltage, low cost, and small package size makes this amplifier ideal for portable/battery-powered equipment. The LMX321 single op amp is available in ultra-small 5-pin SC70 and space-saving 5-pin SOT23 packages.
B. Absolute Maximum Ratings Item Supply Voltage (V CC to VEE) Differential Input Voltage (VIN+ - VIN-) OUT_ to VEE Short-Circuit Duration (OUT_ shorted to VCC or VEE) Continuous Power Dissapation (TA = +700C) Storage Temp. Junction Temperature Lead Temp. (10 sec.) Power Dissipation 5 Lead SOT23 5 Lead SC70 Derates above +70C 5 Lead SOT-23 5 Lead SC70 Rating -0.3V to +8V VEE to VCC -0.3V to (VCC + 0.3V) Continuous -65C to +150C +150C +300C 571mW 247mW 7.1mW/C 3.1mW/C
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Single, General Purpose, Low-Voltage, Rail-to-Rail Op Amp CB20 (High Speed Complementary Bipolar Process) 88 Oregon, USA Philippines, Malaysia or Thailand July, 2001
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: 5 Lead SOT-23 Copper Solder Plate Silver-filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2501-0167 Class UL94-V0 5-Lead SC70 Alloy 42 Solder Plate Silver-filled Epoxy Gold (1 mil dia.) Epoxy with silica filler Buildsheet # 05-2501-0168 Class UL94-V0
I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 31 x 30 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) Gold None 2 microns (as drawn) 2 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord Bryan Preeshl Kenneth Huening (Reliability Lab Manager) (Executive Director) (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 79 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 13.76 x 10-9 = 13.76 F.I.T. (60% confidence level @ 25C)
This low failure rate represents d ata collected from Maxim's reliability monitor program. In addition to routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In Schematic (Spec. # 06-5662) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test monitors. This data is published in the Product Reliability Report (RR-1L). B. Moisture Resistance Tests Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard 85C/85%RH testing is done per generic device/package family once a quarter. C. E.S.D. and Latch-Up Testing The OX63 die type has been found to have all pins able to withstand a transient pulse of 25000V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results LMX321AXK
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION PACKAGE SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C Biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
79
0
DC Parameters & functionality
SC70 SOT23
77 99
0 0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots for the package. Note 2: Generic package/process data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open.
c. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
TERMINAL D Mil Std 883D Method 3015.7 Notice 8
ONCE PER SOCKET
10 K
ONCE PER BOARD
10 OHMS
+5V 1.0 uA
0.1uF
1
6
2
2K
5
3
6 - SOT
4
18 K 10 K
DEVICES: MAX 4464/4470/4400/4401/4480/4481/ 4490/4291/4465/4466/4335/4336/4245/LMX321/4231 MAX CURRENT: MAX4481/MAX4291/LMX321= 800uA / MAX4464/4470/ 4480/4465/4466= 400uA / MAX4400/4401/4245=1.2mA / MAX4490=2.5mA MAX4435/4436/4231/4230=3.4mA
DRAWN BY: TODD BEJSOVEC
DOCUMENT I.D. 06-5662
REVISION E
MAXIM TITLE: BI Circuit (MAX4464/4470/4465/4466/4400/4401/4480/4481/4490/4291/4335/4336/4245/LMX321/ 4231/4230)
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